Laser processing method for increasing hole diameter
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United States of America
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Jun 21, 2019
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Jun 21, 2019
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A method for laser drilling holes on a moving web of material wherein the laser system can be used to drill holes having a diameter less than about 300 micron and holes having a diameter greater than about 300 micron without increasing the energy of the laser beam, and without laser profiling the hole to increase the diameter. The method comprises pulsing the laser beam a plurality of times while directing the focal point of the laser beam for each pulse on to the same target area on the material to produce a hole having an increased diameter.
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