METHOD OF METAL POLISHING AND OXIDATION FILM PROCESS AND SYSTEM THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America
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app pub date -
Feb 6, 2017
filing date -
Feb 6, 2017
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Abstract
The present invention is a method of metal polishing and oxidation film process applied on a metal workpiece. The process comprises (a) providing the metallic workpiece in an electrolysis polishing liquid; (b) a temperature control device controlling a liquid temperature of the electrolysis polishing liquid; (c) a voltage supply device to exercising an operating voltage between the metallic workpiece and the electrolysis polishing liquid; (d) polishing the surface of the metallic workpiece and forming an oxidation layer by regulating the temperature control device and the voltage supply device; and (e) determining a film thickness of the oxidation layer formed on the metallic workpiece according to an operation time, wherein the film thickness is related to a roughness and a color displayed on the metallic workpiece. The metallic workpiece may be dyed together during the polishing process without adding any dyes. The present invention further provides a system of alloy oxidation film process.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MING CHI UNIVERSITY OF TECHNOLOGY | NO 84 GONGZHUAN RD TAISHAN DIST NEW TAIPEI CITY 243089 |
International Classification(s)

- 2017 Application Filing Year
- C25F Class
- 74 Applications Filed
- 55 Patents Issued To-Date
- 74.33 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
LEE, Chun Ying | New Taipei City, TW | 1 | 0 |
# of filed Patents : 1 Total Citations : 0 | |||
PENG, Kun Cheng | New Taipei City, TW | 1 | 0 |
# of filed Patents : 1 Total Citations : 0 | |||
SU, Bo Yan | New Taipei City, TW | 1 | 0 |
# of filed Patents : 1 Total Citations : 0 | |||
WANG, Wei Chun | New Taipei City, TW | 3 | 0 |
# of filed Patents : 3 Total Citations : 0 |
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Patent Citation Ranking
- 0 Citation Count
- C25F Class
- 0 % this patent is cited more than
- 6 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 19, 2027 |
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Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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