MANUFACTURING LINE FOR SOLDERING

Number of patents in Portfolio can not be more than 2000

United States of America

SERIAL NO

16305431

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The disclosure relates to a manufacturing line for soldered components on a circuit board, comprising a soldering oven including at least two temperature zones having a predetermined temperature profile, a transport apparatus embodied to transport circuit boards through the temperature zones, and a control system, wherein, in at least one of the temperature zones, at least two heating elements are arranged such that a to-be-soldered surface of each circuit board is heated by the heating elements, wherein, in at least one of the temperature zones, at least two air circulators are arranged in the transport direction offset from one another and facing the surface to be soldered, and wherein the control system is configured to control the heating elements and the air circulators such that the to-be-soldered surface of the circuit board is heated according to the predetermined temperature profile.

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Patent Owner(s)

Patent OwnerAddress
ENDRESS+HAUSER SE+CO KGHAUPTSTR 1 79689 MAULBURG 79689

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hippin, Christoph Grenzach-Wyhlen, DE 3 3

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