FLUXES EFFECTIVE IN SUPPRESSING NON-WET-OPEN AT BGA ASSEMBLY
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United States of America
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Oct 28, 2018
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Oct 28, 2018
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The disclosure describes techniques for eliminating or reducing non-wet open (NWO) defect formation by using a low activity flux to prevent a solder paste from sticking to ball grid array (BGA) solder balls during reflow soldering. The low activity flux may be configured such that: i) it creates a barrier that prevents the solder paste from sticking to the solder balls of the BGA; and ii) it does not impede the formation of solder joints during reflow. In implementations, a solid coating of the low activity flux may be formed over balls of the BGA, and the BGA may then be bonded to a PCB during reflow. In implementations, the balls of a BGA may be dipped in a low-activity creamy or liquid flux prior to reflow. In some implementations, the flux may applied on a solder paste printed on pads of the PCB, followed by placement of a BGA.
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