EARPHONE WITH SEALING PROCESS BETWEEN LEATHER SHEATH AND LOUDSPEAKER COVER WITH SOFT RUBBER RING
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
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app pub date -
Jul 23, 2019
filing date -
Jul 23, 2019
priority date (Note) -
Published
status (Latency Note)
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Importance

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Non-US Coverage
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Abstract
The present invention discloses an earphone with sealing process between a leather sheath and a loudspeaker cover with a soft rubber ring, comprising a leather sheath bracket. A soft rubber ring is arranged between the leather sheath bracket and a loudspeaker cover. A loudspeaker is fixed to an upper part of the loudspeaker cover. During assembly, the leather sheath is simply pressed and buckled towards the direction of the loudspeaker cover; and the soft rubber ring is clamped to deform to seal the matching between the leather sheath bracket and the loudspeaker cover, so that the sound from the loudspeaker in the earphone does not leak from a side surface. The method is stable in the sealing effect for a long time, has no risk of air leakage, is simple in operation, saves production and assembly man-hours, is easy in rework and repair and has no material scrapping.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
INNOVATION SOUND TECHNOLOGY CO LTD | BUILDING 2ND INDUSTRIAL AREA OF HUAIDE CUIHAI FENGTANG ROAD SHENZHE GUANGDONG 518103 |
International Classification(s)

- 2019 Application Filing Year
- H04R Class
- 3996 Applications Filed
- 3112 Patents Issued To-Date
- 77.88 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Mung, Wai Yin | Shenzhen, CN | 23 | 31 |
# of filed Patents : 23 Total Citations : 31 | |||
Wu, Ka Ming | Shenzhen, CN | 23 | 40 |
# of filed Patents : 23 Total Citations : 40 | |||
Yuen, Shun Ming | Shenzhen, CN | 46 | 638 |
# of filed Patents : 46 Total Citations : 638 |
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Patent Citation Ranking
- 0 Citation Count
- H04R Class
- 0 % this patent is cited more than
- 6 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 28, 2027 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 28, 2031 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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