SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
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United States of America
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Jul 30, 2019
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Jul 30, 2019
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Abstract
A semiconductor device includes: a primary molded body includes a semiconductor chip that has a detector for detecting a physical quantity, and a primary molded resin having a resin material; a housing component includes an insertion hole for inserting the primary molded body; and a secondary molded resin, which is made of a resin material, that integrally covers a region exposed from the insertion hole, the region being a part of a surface of the primary molded body, and a part of a region of a surface of the housing component including a region surrounding the insertion hole. A part of the primary molded body including the semiconductor chip is in the insertion hole.
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