Cluster tool system with step ladder assembly
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United States of America Patent
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Sep 15, 2020
Grant Date -
Nov 14, 2019
app pub date -
Jul 26, 2019
filing date -
Jul 12, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A cluster tool system, including: a load lock; a first wafer transfer module; a buffer module; a second wafer transfer module; wherein the load lock, the first wafer transfer module, the buffer module, and the second wafer transfer module are positioned in a linear arrangement; a first process module connected to the first wafer transfer module on a first side of the linear arrangement; a second process module connected to the second wafer transfer module on the first side; a third process module connected to the first wafer transfer module on a second side of the linear arrangement that is opposite the first side; a fourth process module connected to the second wafer transfer module on the second side; a first ladder assembly connected to the buffer module on the first side; a second ladder assembly connected to the buffer module on the second side.
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