CLEANING LIQUID COMPOSITION

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20190345419A1
SERIAL NO

16473625

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a cleaning liquid composition which is useful for cleaning of a substrate or the like that has been subjected to a chemical mechanical polishing (CMP) process, etc in the production steps of an electronic device such as a semiconductor element. A cleaning liquid composition according to the present invention is used for the purpose of cleaning a substrate that has a Cu wiring, and comprises one or more basic compounds and one or more nitrogen-containing monocyclic heterocyclic aromatic compounds that contain one or more carboxyl groups or ester groups, provided that in cases where one or more amino groups are contained therein, only amino groups directly bonded to a nitrogen-containing heterocyclic rind are contained. This cleaning liquid composition has a hydrogen ion concentration (pH) of 8-12.

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Patent Owner(s)

Patent OwnerAddress
KANTO KAGAKU KABUSHIKI KAISHATOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MORITA, Kikue Saitama, JP 5 27
OHWADA, Takuo Saitama, JP 18 94
TAKANAKA, Areji Saitama, JP 3 0

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