Manufacturing a package using plateable encapsulant
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United States of America Patent
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Issued Date -
Nov 7, 2019
app pub date -
Jul 17, 2019
filing date -
Mar 3, 2016
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Abstract
A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.
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