MOLD AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Nov 7, 2019
app pub date -
Jul 22, 2019
filing date -
Oct 14, 2015
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Abstract
A method for manufacturing a mold includes forming a groove in a back surface of a mold body configured to mold a resin or a rubber by cutting or by electrical discharge machining the back surface of the mold body, placing a porous conductive sheet, including a plurality of through holes and being conductive at least at a surface of the porous conductive sheet, on the back surface of the mold body so as to cover the groove, and temporarily fixing the porous conductive sheet to the back surface of the mold body by spot welded portions, wherein a part of the porous conductive sheet which covers the groove has a flat shape, and performing electroforming to cause an electroformed metal to be electrodeposited on the back surface of the mold body and on the porous conductive sheet.
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