Resin-molded electronic device with disconnect prevention
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United States of America Patent
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Apr 14, 2020
Grant Date -
Oct 24, 2019
app pub date -
Nov 16, 2017
filing date -
Feb 27, 2017
priority date (Note) -
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Abstract
An electronic device includes an electronic component having electrodes, a resin molded body embedding the electronic component such that the electrodes are exposed, a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and wires formed on the resin molded body and the resin member and respectively connected to the electrodes. A thermal expansion coefficient of the resin member is lower than a thermal expansion coefficient of the resin molded body and is higher than a thermal expansion coefficient of the electrodes.
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