Resin-molded electronic device with disconnect prevention
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Apr 14, 2020
Grant Date -
Oct 24, 2019
app pub date -
Nov 16, 2017
filing date -
Feb 27, 2017
priority date (Note) -
In Force
status (Latency Note)
Importance
Calculated Rating
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US Family Size
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Non-US Coverage
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Abstract
An electronic device includes an electronic component having electrodes, a resin molded body embedding the electronic component such that the electrodes are exposed, a resin member interposed between the resin molded body and the electronic component and exposed from the resin molded body, and wires formed on the resin molded body and the resin member and respectively connected to the electrodes. A thermal expansion coefficient of the resin member is lower than a thermal expansion coefficient of the resin molded body and is higher than a thermal expansion coefficient of the electrodes.
First Claim
Other Claims data not available
Family
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| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| JP | B2 | JP6693441 | Feb 27, 2017 |
| WO | A1 | WO2018154879 | Nov 16, 2017 |
| EP | B1 | EP3589089 | Nov 16, 2017 |
| CN | B | CN110024493 | Nov 16, 2017 |
| TW | B | TWI657723 | Nov 27, 2017 |
International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 14, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 14, 2031 |
