SENSOR MODULE
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United States of America Patent
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Issued Date -
Oct 17, 2019
app pub date -
Apr 16, 2019
filing date -
Apr 16, 2018
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Abstract
A sensor module for obtaining sensor data relevant to a piece of equipment. The sensor module comprises a housing including a base. The base includes a mounting assembly for securing the sensor module to the piece of equipment. The sensor module additionally comprises a processing assembly at least partially enclosed within an interior space presented by the housing. The processing assembly includes a first temperature sensor configured to measure a temperature of the interior space of the housing. The processing assembly additionally includes a second temperature sensor configured to measure a temperature external to the housing. The processing assembly additionally includes a vibration sensor configured to measure vibrations experienced by the sensor module. The processing assembly further includes a communication element for wirelessly transmitting the sensor data.
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