METHOD OF PLATING A METALLIC SUBSTRATE TO ACHIEVE A DESIRED SURFACE COARSENESS
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United States of America Patent
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Oct 17, 2019
app pub date -
Oct 20, 2017
filing date -
Oct 20, 2016
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Abstract
A method of plating a metallic substrate to achieve a desired surface coarseness includes: plating a metallic substrate with a source metal using a plating solution containing the source metal to produce a plated layer; and during said plating, varying at least one of multiple plating parameters to achieve a value of a coarseness metric of a surface of the plated layer above a minimum predetermined target value of the coarseness metric. Determining a value of a coarseness metric of a plated layer on a metallic substrate includes obtaining a magnified image of a surface of a plated layer recorded by a magnification device; identifying a path across the magnified image that crosses a plurality of pixels; and determining a contrast among the plurality of pixels.
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