METHODS FOR ACQUIRING PLANAR VIEW STEM IMAGES OF DEVICE STRUCTURES
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United States of America
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Sep 10, 2019
Grant Date -
Oct 3, 2019
app pub date -
May 21, 2018
filing date -
May 21, 2018
priority date (Note) -
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Abstract
A method of preparing a sample of a semiconductor device that includes placing a wafer on a support surface, milling an initial lamella within the wafer using a focused ion beam, lifting the initial lamella out of the wafer, placing the initial lamella on an upper surface of the wafer on a lateral side of the initial lamella, milling a planar lamella out of a portion of the initial lamella and the wafer beneath the initial lamella, lifting the planar lamella out of the wafer; and placing the planar lamella on a carbon grid. A method further includes milling a window within an upper portion of the initial lamella exposing internal structures of the initial lamella; and based at least partially on the exposed internal structures of the initial lamella, aligning the initial lamella on the upper surface of the wafer.
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