SEMICONDUCTOR PACKAGES
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United States of America Patent
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Issued Date -
Sep 26, 2019
app pub date -
Aug 8, 2018
filing date -
Mar 23, 2018
priority date (Note) -
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Abstract
A package is disclosed. The package includes a carrier that comprises a first conductive layer on a first side and a second conductive layer on a second side opposite the first side. The first conductive layer comprises wire bonding pads. The package also includes a semiconductor die that is flip chip mounted on the first side of the carrier.
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