SYSTEMS AND METHODS FOR DEPOSITING COMPOUNDS IN A STRUCTURE
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United States of America Patent
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Issued Date -
Sep 26, 2019
app pub date -
Jun 13, 2019
filing date -
Mar 8, 2016
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Abstract
Presently disclosed systems and methods for depositing a compound into a void in a sandwich panel are configured to reduce the air pressure in and around the void as the compound flows into the void, thereby reducing the amount of air trapped between the compound and the sandwich panel skin within the void during the repair. Systems may include a dispenser for holding the compound, a vacuum canister, and a valve operable to allow the compound to flow from the dispenser, through at least a portion of the vacuum canister, and into the void. After the compound flows into the void, the system is configured to apply ambient air pressure to the compound and the void, before the compound is allowed to harden or cure. Some such systems are pre-filled with the compound, and/or configured to be disposable after a single use.
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