Thermoelectric-based thermal management system
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United States of America Patent
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Sep 22, 2020
Grant Date -
Aug 15, 2019
app pub date -
Apr 18, 2019
filing date -
Jan 30, 2013
priority date (Note) -
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Abstract
Disclosed embodiments include thermoelectric-based thermal management systems and methods configured to heat and/or cool an electrical device. Thermal management systems can include at least one electrical conductor in electrical and thermal communication with a temperature-sensitive region of the electrical device and at least one thermoelectric device in thermal communication with the at least one electrical conductor. Electric power can be directed to the thermoelectric device by the same electrical conductor or an external power supply, causing the thermoelectric device to provide controlled heating and/or cooling to the electrical device via the at least one electrical conductor. The thermoelectric management system can be integrated with the management system of the electrical device on a printed circuit substrate.
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