SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
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United States of America Patent
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Issued Date -
Aug 15, 2019
app pub date -
Apr 23, 2019
filing date -
Aug 24, 2017
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Abstract
A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
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