Method for arranging a plurality of seed substrates on a carrier element and carrier element having seed substrates
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United States of America Patent
Stats
-
Mar 9, 2021
Grant Date -
Jul 11, 2019
app pub date -
Aug 24, 2017
filing date -
Sep 22, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for arranging a plurality of semiconductor seed substrates on a carrier element, in which for applying a semiconductor layer to the seed substrates, the seed substrates are arranged on the carrier element by integral bonding. A carrier element having integrally bonded seed substrates for coating with a semiconductor layer is also provided.
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International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 4 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 9, 2028 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 9, 2032 |
