Waveguide interface and printed circuit board launch transducer assembly and methods of use thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 27, 2020
Grant Date -
Jul 4, 2019
app pub date -
Dec 29, 2017
filing date -
Dec 29, 2017
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board assembly comprising a plurality of layers. At least one of the plurality of layers is formed of a dielectric material and has an extended portion extending beyond the other layers in the plurality of layers. A first metallic layer is located on at least a portion of the extended portion of the dielectric layer. The first metallic layer and the dielectric layer are configured to form a launch transducer comprising one or more transmission lines and a transducer element coupled to the one or more transmission lines. The transducer element is configured to propagate millimeter wave frequency signals.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully