Vacuum pump using profile

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United States of America Patent

PATENT NO 11149752
APP PUB NO 20190203738A1
SERIAL NO

16330741

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Abstract

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The present invention relates to a vacuum pump using a profile. The vacuum pump according to the present invention comprises: a hollow profile having a longitudinal mounting hole and a vacuum chamber formed adjacent to each other; an ejector pump arranged inside the mounting hole in the longitudinal direction; and end caps provided in both openings of the profile, respectively, so as to have a through-hole formed therein so as to correspond to the inflow opening or the discharge opening. Particularly, the first cap near the inflow opening is designed to have a passage through which the vacuum chamber and the mounting hole communicate with each other. The vacuum pump structure according to the present invention is considered to be a vacuum pump structure using at least a so-called “profile” best designed to make fabrication of the vacuum pump convenient and to improve vacuum characteristics.

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Patent Owner(s)

  • VTEC CO., LTD.

International Classification(s)

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  • 2017 Application Filing Year
  • H01L Class
  • 30754 Applications Filed
  • 25260 Patents Issued To-Date
  • 82.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Ho-Young Seoul, KR 37 170

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1445612453334991910216201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 80010002000300040005000600070008000900010000110001200013000140001500016000

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