LIGHT EMITTING DIODE EPITAXIAL WAFER AND METHOD FOR MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20190198708A1
SERIAL NO

15940911

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Abstract

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An epitaxial wafer as a light emitting diode (LED) comprises a sapphire substrate, a buffer layer, an N-type semiconductor layer, a light emitting active layer, and a P type semiconductor layer. The buffer layer, the N-type semiconductor layer, the light emitting active layer, and the P type semiconductor layer are formed on C-plane of the sapphire substrate in that order. The light-emitting active layer comprises at least one quantum well structure, with a quantum well region, a gradient region, a high-content aluminum region, and a blocking region. The blocking region covers and is connected to the high-content aluminum region, the P-type semiconductor layer of aluminum-doped or indium-doped gallium nitride covers the gradient region. Content of aluminum or indium changes linearly from side close to the N-type semiconductor layer to side furthest from the N-type semiconductor layer.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED OPTOELECTRONIC TECHNOLOGY INCNO 13 GONGYE 5TH RD HSINCHU INDUSTRIAL PARK HUKOU SHIANG HSINCHU HSIEN 303

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHIU, CHING-HSUEH Hukou, TW 31 49
LIN, YA-WEN Hukou, TW 74 143
TU, PO-MIN Hukou, TW 91 290

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