Methods of forming micropatterns and substrate processing apparatus
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United States of America Patent
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Feb 9, 2021
Grant Date -
Jun 27, 2019
app pub date -
Dec 27, 2018
filing date -
Dec 27, 2017
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Abstract
Provided herein is a method of forming micropatterns, including: forming an etching target film on a substrate; forming a photosensitivity assisting layer on the etching target film, the photosensitivity assisting layer being terminated with a hydrophilic group; forming an adhesive layer on the photosensitivity assisting layer, the adhesive layer forming a covalent bond with the hydrophilic group; forming a hydrophobic photoresist film on the adhesive layer; and patterning the photoresist film.
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