Resin composition, prepreg, and copper clad laminate
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United States of America Patent
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Jun 30, 2020
Grant Date -
Jun 27, 2019
app pub date -
Dec 28, 2017
filing date -
Dec 25, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A resin composition is provided, which includes 1 part by weight of (a) thermally conductive resin with a biphenyl group, 1.0 to 10.0 parts by weight of (b) polyphenylene oxide, 0.01 to 5.0 parts by weight of (c) hardener, and 0.1 to 5.0 parts by weight of (d) inorganic filler. (d) Inorganic filler is boron nitride, aluminum nitride, silicon nitride, silicon carbide, aluminum oxide, carbon nitride, octahedral carbon, or a combination thereof with a surface modified by iron-containing oxide. (d) Inorganic filler is sheet-shaped or needle-shaped.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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