SOLDERING DEVICE

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United States of America Patent

APP PUB NO 20190176256A1
SERIAL NO

16321981

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A control device of soldering device identifies the type of lead component to be soldered when soldering multiple types of lead components sequentially with jet device and reads out a value of a soldering parameter corresponding to the lead component type from an HDD. Then, the control device controls jet device so that the lead component is soldered based on the value of the soldering parameter. As a result, the lead of the lead component is soldered with the value of the soldering parameter corresponding to the type of the lead component.

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Patent Owner(s)

Patent OwnerAddress
FUJI CORPORATIONCHIRYU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IWAKI, Noriaki Hekinan-shi, JP 43 199
OTSUBO, Satoru Anjo-shi, JP 9 15

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