Solder reflow apparatus and method of manufacturing an electronic device
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United States of America Patent
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Nov 2, 2021
Grant Date -
Jun 6, 2019
app pub date -
Sep 21, 2018
filing date -
Dec 6, 2017
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Abstract
In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.
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