PRESSURIZING DEVICE AND PRESSURIZING METHOD

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United States of America Patent

APP PUB NO 20190139769A1
SERIAL NO

16095987

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pressurizing device includes: a mounting base; an upper mold which pressurizes the target object mounted on the mounting base from above; a heating lower mold which is a lower mold heated in advance by a heater, and which heats the target object under pressure by sandwiching the mounting base with the upper mold; a cooling lower mold which is a lower mold cooled in advance by a cooler, and which cools the target object under pressure by sandwiching the mounting base with the upper mold; and a control device which switches the lower mold that contributes to the pressurization of the target object to the heating lower mold or the cooling lower mold in accordance with the status of progress of the pressurization process for the target object.

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Patent Owner(s)

Patent OwnerAddress
NIKKISO CO LTDSHIBUYA-KU TOKYO 150-6022

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IDESAKO, Satoshi Higashimurayama-shi, JP 2 1
MORI, Takahiro Higashimurayama-shi, JP 271 3230

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