Microelectromechanical system (MEMS) devices

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United States of America Patent

PATENT NO 10640369
APP PUB NO 20190119104A1
SERIAL NO

16094287

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Abstract

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One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT-PACKARD DEVELOPMENT COMPANY L P10300 ENERGY DRIVE SPRING TX 77389

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hua Corvallis, US 409 3027
Choy, Si-lam J Corvallis, US 22 47
Cumbie, Michael W Corvallis, US 272 997
Mourey, Devin Alexander Corvallis, US 36 107

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