Induction molding for parts having thermoplastic portions
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United States of America Patent
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Oct 6, 2020
Grant Date -
Apr 25, 2019
app pub date -
Oct 24, 2017
filing date -
Oct 24, 2017
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Abstract
Systems and methods are provided for molding systems that have a low thermal mass. One embodiment is a first tool that includes a first frame. The first frame includes a first set of plates of magnetically permeable material, and a material disposed between plates of the first set. The first tool also includes a first set of induction coils that are disposed within the first frame and that generate a first electromagnetic field, and a first susceptor that extends from the first set of plates. The first susceptor generates heat in response to the first electromagnetic field. The first tool further includes a mold that extends from the first susceptor and receives heat via conductive heat transfer from the first susceptor. Each plate of the first set is thinner than a skin depth at which the first electromagnetic field would generate an electrical induction current.
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