CUSTOMIZED MODULE LID
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United States of America Patent
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Issued Date -
Apr 11, 2019
app pub date -
Nov 30, 2018
filing date -
Nov 7, 2014
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Abstract
A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.
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