THERMAL VAPOR CHAMBER ARRANGEMENT
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United States of America Patent
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Issued Date -
Apr 4, 2019
app pub date -
Oct 3, 2017
filing date -
Oct 3, 2017
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Abstract
In some examples, a multiple chip module (MCM) includes a heat sink; a circuit board; a first chip secured to a first location on the circuit board; a first vapor chamber thermally coupled to the first chip to pass heat generated by the first chip to the heat sink; a second chip secured to a second location on the circuit board; and a second vapor chamber thermally coupled to the second chip to pass heat generated by the second chip to the heat sink. In some examples, a portion of the second vapor chamber is positioned between a portion of the first vapor chamber and the heat sink. In some examples, the first vapor chamber is substantially thermally insulated from the second vapor chamber.
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