METHOD FOR PREPARING A SEMICONDUCTOR STRUCTURE
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United States of America Patent
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Issued Date -
Mar 28, 2019
app pub date -
Nov 21, 2018
filing date -
Nov 21, 2018
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Abstract
A method for preparing a semiconductor structure includes the steps of providing a substrate; forming a recess over the substrate; disposing a conductive layer over the substrate; and disposing a passivation over the substrate to at least partially cover the conductive layer.
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