Wafer Support Assembly Including Ion Implantation Mask Structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20190051554A1
SERIAL NO

15834676

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Abstract

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A wafer support assembly can include a wafer chuck including a first surface and a second surface, where the first surface can have a central region that is configured to hold a wafer during ion implantation into the wafer, and an edge region surrounding the central region beyond an edge of the wafer when held in the central region, and the second surface opposing the first surface. An edge mask structure can cover at least a portion of the edge region of the first surface, where the edge mask structure can have a mask body with an inclined side surface facing the central region.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, HanMei Seoul, KR 35 1119
Choi, Kyung In Seoul, KR 24 167
Choi, Sun Hong Hwaseong-si, KR 7 165
Han, Sang Hoon Seoul, KR 92 655
Kim, Tae Gon Seoul, KR 151 604
Song, Hyun Chul Seoul, KR 5 63

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