Package module
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United States of America Patent
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Jun 4, 2019
Grant Date -
Jan 31, 2019
app pub date -
Sep 27, 2018
filing date -
Jun 16, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.
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