METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH
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United States of America Patent
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Jan 24, 2019
app pub date -
Sep 13, 2018
filing date -
Sep 13, 2018
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Abstract
The present invention relates to an aqueous electroless copper plating bath, including a source for Cu(II) ions, glyoxylic acid as the reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof, wherein the electroless copper plating bath is substantially free of Na+, K+ and tetraalkylammonium ions.
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