MULTILAYER STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS
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United States of America Patent
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Issued Date -
Jan 17, 2019
app pub date -
Apr 5, 2016
filing date -
Apr 5, 2016
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Abstract
In one example, a housing for an electronic device may be disclosed which may include a first multi-layer structure. The first multi-layer structure may include a first layer and a second layer formed on the first layer. Each of the first layer and the second layer may include a plurality of protruding features and a plurality of recessing features on an edge of the first layer and the second layer. At least one of the plurality of recessing features of one layer may intersect at least one of the plurality of protruding features of other layer.
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