Method of manufacturing chemical fluid for manufacturing electronic material, pattern forming method, method of manufacturing semiconductor device, chemical fluid for manufacturing electronic material, container, and quality inspection method

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United States of America Patent

PATENT NO 11429018
APP PUB NO 20190011827A1
SERIAL NO

16129826

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Abstract

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In a method of manufacturing a chemical fluid for manufacturing an electronic material, a method of reducing particulate metal in the chemical fluid is selected according to a concentration of particulate metal including an iron atom, a concentration of particulate metal including a copper atom, and a concentration of particulate metal including a zinc atom which are measured by SP ICP-MS in the chemical fluid, and at least one of the concentration of particulate metal including an iron atom, the concentration of particulate metal including a copper atom, or the concentration of particulate metal including a zinc atom is reduced by using the selected reducing method.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATION26-30 NISHIAZABU 2-CHOME MINATO-KU TOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawada, Yukihisa Shizuoka, JP 14 12
Shimizu, Tetsuya Shizuoka, JP 179 1598
Yamanaka, Tsukasa Shizuoka, JP 34 341

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