Means for carrying out electroless metal deposition with atomic sub-monolayer precision

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United States of America Patent

PATENT NO 12024778
APP PUB NO 20190010609A1
SERIAL NO

16064140

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Abstract

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The present invention relates to a method of deposition of thin metal layers on different substrates by electroless chemical method. In the method of the invention, the potential of the plating solution, i.e. a solution from which the metal deposition is carried out, is controlled with a redox buffer. The appropriate plating solution is also disclosed.

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UNIWERSYTET WARSZAWSKI00-927 WARSZAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Januszewska, Aneta Warsaw, PL 1 0
Jurczakowski, Rafal Brwinow, PL 9 11
Lewera, Adam Warsaw, PL 8 8
Polczynski, Piotr Grodzisk Mazowiecki, PL 5 2
Szabat, Huber Warsaw, PL 1 0

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