Method for manufacturing aluminum plate and apparatus for manufacturing aluminum plate

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United States of America Patent

PATENT NO 10844509
APP PUB NO 20190003073A1
SERIAL NO

16124382

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An object is to provide a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction in which the locations of the through-holes are controlled and a manufacturing apparatus that is used in the method for manufacturing the aluminum plate. A method for manufacturing an aluminum plate of the present invention is a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction, the method including a coating-forming step of forming a coating of an aluminum compound on a surface of an aluminum substrate having a thickness of 5 to 1,000 μm, a partial coating removal step of removing, out of the coating, the coating present on portions in which the through-holes need to be formed, and a through-hole-forming step of forming the through-holes in the aluminum substrate by carrying out an electrochemical melting treatment on the aluminum substrate after the partial coating removal step.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATIONTOKYO

International Classification(s)

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  • 2018 Application Filing Year
  • C25D Class
  • 679 Applications Filed
  • 437 Patents Issued To-Date
  • 64.36 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hotta, Hisashi Haibara-gun, JP 45 386
Kasuya, Yuichi Haibara-gun, JP 20 164

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  • C25D Class
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  • 5 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges2951432101 - 1011 - 2021 - 30020406080100120140160180200220240260280300320

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