Method for manufacturing aluminum plate and apparatus for manufacturing aluminum plate
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United States of America Patent
Stats
-
Nov 24, 2020
Grant Date -
Jan 3, 2019
app pub date -
Sep 7, 2018
filing date -
Mar 25, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An object is to provide a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction in which the locations of the through-holes are controlled and a manufacturing apparatus that is used in the method for manufacturing the aluminum plate. A method for manufacturing an aluminum plate of the present invention is a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction, the method including a coating-forming step of forming a coating of an aluminum compound on a surface of an aluminum substrate having a thickness of 5 to 1,000 μm, a partial coating removal step of removing, out of the coating, the coating present on portions in which the through-holes need to be formed, and a through-hole-forming step of forming the through-holes in the aluminum substrate by carrying out an electrochemical melting treatment on the aluminum substrate after the partial coating removal step.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
FUJIFILM CORPORATION | TOKYO |
International Classification(s)

- 2018 Application Filing Year
- C25D Class
- 679 Applications Filed
- 437 Patents Issued To-Date
- 64.36 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hotta, Hisashi | Haibara-gun, JP | 45 | 386 |
# of filed Patents : 45 Total Citations : 386 | |||
Kasuya, Yuichi | Haibara-gun, JP | 20 | 164 |
# of filed Patents : 20 Total Citations : 164 |
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Patent Citation Ranking
- 0 Citation Count
- C25D Class
- 0 % this patent is cited more than
- 5 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 24, 2028 |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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