Etching solution for copper and copper alloy surfaces

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United States of America Patent

PATENT NO 10619251
APP PUB NO 20190003061A1
SERIAL NO

16065200

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Abstract

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An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I)

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Patent Owner(s)

Patent OwnerAddress
ATOTECH DEUTSCHLAND GMBHBERLIN GERMANY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gaida, Josef Berlin, DE 14 122
Hülsmann, Thomas Berlin, DE 3 2
Lützow, Norbert Berlin, DE 7 6
Michalik, Fabian Berlin, DE 5 9
Schmidt, Gabriela Berlin, DE 3 4

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