METAL ELECTRODE LEADLESS FACE (MELF) DEVICE CRADLE
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United States of America Patent
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Issued Date -
Dec 13, 2018
app pub date -
Jun 8, 2018
filing date -
Jun 8, 2018
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Abstract
A cradle for a metal electrode leadless face (MELF) device is provided. The cradle can include at least one pad, such as a solder pad, to be connected to a printed circuit board (PCB) or similar board. The pad can be configured to receive a MELF device. Such a configuration can improve positioning and alignment of the MELF device and prevent or reduce movement of the MELF device prior to or during soldering. The pad can include boundaries to engage the MELF device for alignment and to prevent or reduce movement. The boundaries of the pad can include inlets, extensions, troughs, borders, and/or other features to engage the MELF device. Boards including such cradles are also provided. Further, methods of installing a MELF device on a board using a cradle are also provided.
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