Semiconductor package having discrete antenna device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10847869
APP PUB NO 20180358685A1
SERIAL NO

15974700

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Abstract

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One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.

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Patent Owner(s)

Patent OwnerAddress
MEDIATEK INCNO 1 DUSING RD 1 HSINCHU SCIENCE PARK HSIN-CHU 300 30078

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Nan-Cheng Hsinchu, TW 43 540
Chou, Che-Ya Kaohsiung, TW 40 457
Han, Fu-Yi Taichung, TW 4 25
Kuo, Che-Hung Tainan, TW 29 113
Lin, Min-Chen Hsinchu, TW 8 58
Liu, Hsing-Chih Hsinchu, TW 26 73
Wu, Wen-Chou Hsinchu, TW 28 174

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