Method of manufacturing tin-plated copper terminal material
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United States of America Patent
Stats
-
May 28, 2019
Grant Date -
Dec 6, 2018
app pub date -
Dec 14, 2016
filing date -
Dec 15, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing tin-plated copper terminal material as a terminal crimped to a terminal end of an electric wire made of an aluminum wire material, using a base member of copper or copper alloy in which galvanic corrosion is not easy to occur and an adhesiveness of a tin layer is excellent, the method includes: a zinc-nickel alloy layer forming step forming a zinc-nickel alloy layer having a nickel content of 5 mass % to 50 mass % inclusive and a thickness of 0.1 μm to 5.0 μm inclusive on a base member made of copper or copper alloy; and a tin-plating step forming a tin layer by tin plating on the zinc-nickel alloy layer; more preferably, following the tin-plating step, the method includes a diffusion treatment step diffusing zinc from the zinc-nickel alloy layer to the tin layer by maintaining at 40° C. to 160° C. inclusive for 30 minutes or longer.
First Claim
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International Classification(s)
- 2016 Application Filing Year
- C25D Class
- 667 Applications Filed
- 443 Patents Issued To-Date
- 66.42 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C25D Class
- 0 % this patent is cited more than
- 6 Age
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 28, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 28, 2030 |
