Method of determining warp status for corrugated board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 7, 2021
Grant Date -
Dec 6, 2018
app pub date -
Feb 23, 2016
filing date -
Dec 4, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A warp determination device for a corrugated cardboard sheet manufacturing device is provided with: displacement value measurement method for measuring displacement values of a plurality of corrugated cardboard sheet pieces on the downstream side of a slitter scorer and on the upstream side of a sheet stacking unit; and warp status determination means for dividing a measurement range of the displacement value measurement method according to a width dimension of the plurality of corrugated cardboard sheet pieces, allocating the divided measurement ranges to each of the plurality of corrugated cardboard sheet pieces, and determining a warped status of the corrugated cardboard sheet pieces for each of the plurality of corrugated cardboard sheet pieces on the basis of measurement values from the displacement value measurement method in the allocated measurement ranges.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS LTD | 1-1 WADASAKI-CHO 1-CHOME HYOGO-KU KOBE-SHI HYOGO 652-8585 |
International Classification(s)

- 2016 Application Filing Year
- B31F Class
- 111 Applications Filed
- 77 Patents Issued To-Date
- 69.37 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Mizutani, Hideki | Hiroshima, JP | 46 | 318 |
# of filed Patents : 46 Total Citations : 318 | |||
Ogino, Akira | Hiroshima, JP | 84 | 938 |
# of filed Patents : 84 Total Citations : 938 |
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Patent Citation Ranking
- 0 Citation Count
- B31F Class
- 0 % this patent is cited more than
- 4 Age
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