Method of determining warp status for corrugated board

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United States of America Patent

PATENT NO 11110680
APP PUB NO 20180345618A1
SERIAL NO

15779527

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A warp determination device for a corrugated cardboard sheet manufacturing device is provided with: displacement value measurement method for measuring displacement values of a plurality of corrugated cardboard sheet pieces on the downstream side of a slitter scorer and on the upstream side of a sheet stacking unit; and warp status determination means for dividing a measurement range of the displacement value measurement method according to a width dimension of the plurality of corrugated cardboard sheet pieces, allocating the divided measurement ranges to each of the plurality of corrugated cardboard sheet pieces, and determining a warped status of the corrugated cardboard sheet pieces for each of the plurality of corrugated cardboard sheet pieces on the basis of measurement values from the displacement value measurement method in the allocated measurement ranges.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS LTD1-1 WADASAKI-CHO 1-CHOME HYOGO-KU KOBE-SHI HYOGO 652-8585

International Classification(s)

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  • 2016 Application Filing Year
  • B31F Class
  • 111 Applications Filed
  • 77 Patents Issued To-Date
  • 69.37 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mizutani, Hideki Hiroshima, JP 46 318
Ogino, Akira Hiroshima, JP 84 938

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  • 0 Citation Count
  • B31F Class
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  • 4 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges94416101 - 1011 - 2021 - 3005101520253035404550556065707580859095100

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