SEMICONDUCTOR PROCESS
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United States of America Patent
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Issued Date -
Nov 29, 2018
app pub date -
Jul 7, 2017
filing date -
Jul 7, 2017
priority date (Note) -
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Abstract
A semiconductor process including the following steps is provided. A wafer is provided. The wafer has a front side and a back side. The wafer has a semiconductor device on the front side. A protection layer is formed on the front side of the wafer. The protection layer covers the semiconductor device. A material of the protection layer includes a photoresist material. A surface hardening treatment process is performed on the protection layer. A first patterning process is performed on the back side of the wafer. The semiconductor process can effectively protect the front side of the wafer during a backside process.
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