WAFER LEVEL PACKAGING METHOD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 8, 2018
app pub date -
May 3, 2017
filing date -
May 3, 2017
priority date (Note) -
Published
status (Latency Note)
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Importance

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Non-US Coverage
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Abstract
A wafer level packaging method includes the following steps. A first wafer is bonded over a second wafer. A first grinding process on the first wafer is performed, to remove an upper chamfered edge of the first wafer and reduce a thickness of the first wafer. A trimming process is performed on the first wafer, to remove a lower chamfered edge of the first wafer to form a trimmed first wafer. A second grinding process is performed on the trimmed first wafer, to reduce a thickness of the trimmed first wafer.
First Claim
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Family
- No Family data available.
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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UNITED MICROELECTRONICS CORP | HSIN-CHU CITY |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Ding, Wen-Bo | Singapore, SG | 3 | 163 |
# of filed Patents : 3 Total Citations : 163 | |||
Hsu, Chien-En | Singapore, SG | 10 | 221 |
# of filed Patents : 10 Total Citations : 221 | |||
Pang, Chien-Kee | Singapore, SG | 11 | 165 |
# of filed Patents : 11 Total Citations : 165 | |||
Sheng, Zhi-Rui | Singapore, SG | 4 | 165 |
# of filed Patents : 4 Total Citations : 165 | |||
Zhang, Sheng | Singapore, SG | 265 | 1612 |
# of filed Patents : 265 Total Citations : 1612 |
Cited Art Landscape
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Patent Citation Ranking
- 153 Citation Count
- H01L Class
- 99.82 % this patent is cited more than
- 7 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 8, 2026 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 8, 2030 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
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Sep 12, 2024 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 8 |
Sep 15, 2020 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Apr 11, 2017 | I | Issuance | |
Mar 22, 2017 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Sep 03, 2015 | AS | ASSIGNMENT | free format text: MERGER;ASSIGNOR:MISAKI ACQUISITIONS L.L.C.;REEL/FRAME:036958/0877 Owner name: TAMIRAS PER PTE. LTD., LLC, DELAWARE Effective Date: Sep 03, 2015 |
Dec 27, 2012 | P | Published | |
Dec 24, 2012 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:MADNANI, RAJ;REEL/FRAME:029652/0458 Owner name: MISAKI ACQUISITIONS L.L.C., DELAWARE Effective Date: Dec 24, 2012 |
Sep 05, 2012 | F | Filing |

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