METHOD AND SYSTEM FOR APPLYING MATERIALS ON A SUBSTRATE
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United States of America Patent
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Nov 8, 2018
app pub date -
Jun 29, 2018
filing date -
Jun 29, 2018
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Abstract
Embodiments of the invention are directed to a method of printing lines. A method may include positioning a plurality of print units according to a predefined spacing parameter. A method may include depositing material on a substrate by a plurality of print units to form a respective plurality of parallel lines according to a predefined spacing parameter. A printing unit may be positioned at an angle with respect to a predefined scan direction such that a predefined width of a printed line is achieved. A substrate may be rotated between scans such that a plurality of lines in a respective plurality of directions is printed in a scan direction.
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