MOLDING DEVICE HAVING HEATING AND COOLING FUNCTIONS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20180319052A1
SERIAL NO

15968538

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A molding device includes a lower die core assembly including a porous lower die core unit, an upper die core assembly including a porous upper die core, a heating assembly for heating the lower die core unit and the upper die core, and a control assembly operable to control temperature of an assembly of the lower die core unit and the upper die core to be direct proportional to a distance by which the upper die core is moved downwardly from a compression starting position where the upper die core comes into contact with the lower die core unit. The control assembly is further operable to control one of a heated gas and a cooled gas to be introduced into and discharged from the upper and lower mold core assemblies at different rates.

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Patent Owner(s)

Patent OwnerAddress
POU CHEN CORPORATIONNO 2 FU KUNG RD FU HSIN HSIAN CHANG HWA HSIEN 506

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Ju-Cheng Tainan City, TW 7 6
HSIEH, Hung-Wu Xizhou Township, TW 8 6
HUANG, Hsiang-Yu Taichung City, TW 14 112
KUO, Tsung-Wei Changhua City, TW 8 6
LIN, Shih-Chia Yuanlin City, TW 8 6

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