MOLDING DEVICE HAVING HEATING AND COOLING FUNCTIONS
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United States of America Patent
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Issued Date -
Nov 8, 2018
app pub date -
May 1, 2018
filing date -
May 1, 2018
priority date (Note) -
Published
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Abstract
A molding device includes a lower die core assembly including a porous lower die core unit, an upper die core assembly including a porous upper die core, a heating assembly for heating the lower die core unit and the upper die core, and a control assembly operable to control temperature of an assembly of the lower die core unit and the upper die core to be direct proportional to a distance by which the upper die core is moved downwardly from a compression starting position where the upper die core comes into contact with the lower die core unit. The control assembly is further operable to control one of a heated gas and a cooled gas to be introduced into and discharged from the upper and lower mold core assemblies at different rates.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
POU CHEN CORPORATION | NO 2 FU KUNG RD FU HSIN HSIAN CHANG HWA HSIEN 506 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
CHEN, Ju-Cheng | Tainan City, TW | 7 | 6 |
HSIEH, Hung-Wu | Xizhou Township, TW | 8 | 6 |
HUANG, Hsiang-Yu | Taichung City, TW | 14 | 112 |
KUO, Tsung-Wei | Changhua City, TW | 8 | 6 |
LIN, Shih-Chia | Yuanlin City, TW | 8 | 6 |
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