Method of manufacturing band-shaped metal wire member including bonded portion
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United States of America Patent
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Feb 16, 2021
Grant Date -
Nov 8, 2018
app pub date -
Nov 4, 2016
filing date -
Nov 12, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention seeks to enable a band-shaped metal wire member to be stably accommodated within a die. A die is prepared that includes a bottom die provided with a depression and a top die provided with a projection that can be arranged within the depression so as to close off a space above the depression. An inner surface of the depression includes a central die surface formed at a width-direction center of a base of the depression and a pair of curved guide die surfaces provided continuous with two sides of the central die surface and curved so as to project outward. The central die surface is formed as a flat surface or as a surface that curves more gently than the pair of curved guide die surfaces. A bonding process portion of a band-shaped metal wire member is folded in two and arranged within the depression.
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