SUBSTRATE CUTTING CONTROL AND INSPECTION
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United States of America Patent
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Nov 1, 2018
app pub date -
Apr 26, 2017
filing date -
Apr 26, 2017
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Abstract
During a wafer cutting process, the wafer substrate is inspected by illuminating it on both sides, and imaging light which has both been reflected from and transmitted through the substrate. The substrate is supported on a stage, and first and second illumination sources are arranged to respectively illuminate the first surface of the substrate supported by the stage and to illuminate the second surface of the substrate supported by the stage in use. At least one camera is adapted to image light received from the substrate when it is illuminated by the first illumination source and/or the second illumination source.
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